|Model using ACF
|First, check sample COG whether there are enough 5 effective conductive particles per BUMP
|First inspection sample COG BUMP and ITO PAD alignment
|First inspection sample IC back microscopy, no scratches on the back of the IC
|COG Actual state temperature and time in accordance with ACF specifications
|IC BUMP does not press on the overline between ITO PAD
|Model using ACF
|Heat bonding temperature/time in accordance with ACF specifications
|FPA Pull >600gram F/cm
|FPA gold finger and TFT ITO recombined more than 2/3 in the first inspection sample
|5 active conductive particles on the ITO corresponding to each FPA gold finger
|DP190 Adhesive edge width <1.5 mm, height not to exceed the glass surface, and can completely cover the FPC
Goldfinger leaking after the thermal break
|Backlighting, TP welding positioning and joint height control
|FPA pads are guaranteed to leak 0.5 mm during soldering to ensure adequate soldering
|Insulation paper just the right size to cover the solder joint or PAD bit
|No components must be attached to the back of the pads of the BL/TP on the TFT FPA in order to prevent the soldering of the elements pieces of welding joints that are deficient assemble.
|TP should be assembled with good adhesion and not produce TP warping, displacement, etc. (If the TP backing is a water glue, fix it with 406 drops of glue after assembly)
|Whether TP assembly requires special fixtures to meet the positioning accuracy requirements specified in the drawing
|The inaccessibility of the edge of the polarizer to the VA after assembly
|No uneven bright spots/lines in the background light after assembly
|The gap between the glass surface of TP and the polarized sheet of TFT after assembly is >0.2mm; Press strongly with a pen on the adjacent area of the TP surface without any watermarking; after removal, all areas will not
Watermark must remain.
|Backlighting is appropriate for the TFT and does not produce visible edges or shaded rows phenomenon
|The block (BZ) is properly matched to the TP and does not have the potential to cause the TP to crack.
|Components on FPA (after bending) must not interfere with the backlight
|FPA bending and dismantling of the positioning method to ensure that the finished drawing of the positioning size and error of the seek (Consider using an assembly positioning jig if there is no positioning mark on the product)
|Iron frame with backlight will not come loose after assembly
|After assembly, there are no gaps between TP, BL, TFT for dust intake.
|Backlit LBL backed with conductive cloth, double-sided tape, labels, positioning tape, etc. under pressure. No shading of the display and no pulling up of the backlight adhesive paper.
|IC (with RTV adhesive) must not be higher than the backlit bezel after assembly
|After assembly, the height of the polarized sheet on the TFT should not be higher than the backlight frame
|FPA Bending shall not be shorted directly to the iron frame with exposed copper parts.
|Shell openings or sides must not have a blade stabbing into the FPA face to prevent a short circuit.
|TP Pull Tape Tear Film Very Tolerant to Remove Film
|Full product size (key size with *) checked (5 pieces)
|No light leakage within the inner TP screen edge after assembly
|For products with the iron casing, the BL+TFT+ iron casing needs to be bent in 3 pieces, such as IC. If cracking occurs, a sponge adhesive of the appropriate thickness will be applied to the IC or outside (against FPA)
|Drop test results PASS